Following is version 1.2 of XC05 (3/11/96). It is updated from the CDR version in that the following changes have been incorporated:
52100.700.006
TRW XC05 11 Jan 96
52100.700.006
TRW XC05 11 Jan 96
A - 8
XIII
DPD 692 DR XC05
January 1996
NAS8-37710
AXAF
Advanced X-Ray
Astrophysics Facility
X-ray Calibration Facility Interface Definition, HRMA/SI
Calibration
CDR Version
2/19/96 1:09 PM
Prepared by:
Jon Arenberg
AXAF Telescope Project
TRW Space & Technology Group
(310) 814-4800
(310)813-6352FAX
1.0 SCOPE 1
1.1 TEAM MEMBERS 2
1.1.1 MSFC 2
1.1.2 SAO 2
1.1.3 TRW 2
1.1.4 EKC 2
1.1.5 BASD 3
1.1.6 FPSIs 3
1.1.6.1 High Resolution Camera 3
1.1.6.2 AXAF CCD Imaging Spectrometer 3
1.1.7 Objective Transmission Gratings 3
1.1.7.1 High Energy Transmission Grating 3
1.1.7.2 Low Energy Transmission Grating 4
2.0 APPLICABLE DOCUMENTS 5
2.1 REQUIRED DOCUMENTS 5
2.1.1 Team Member Documents 5
2.1.2 Governmental Specifications 6
2.1.3 Drawings 6
3.0 COORDINATE SYSTEMS 9
3.1 XRCF 9
3.1.1 Architectural Coordinate System 9
3.1.2 XRCF Coordinate System 9
3.2 MDS Coordinate System 10
3.3 ATA Coordinate System 10
3.4 SCIENCE INSTRUMENT MODULE FIVE AXIS MOUNT 10
3.5 HRMA 10
3.6 HRMA X-ray Detection System 10
4.0 UNITS 11
4.1 TIME 11
4.2 TEMPERATURE 11
4.3 LENGTH 11
4.4 ANGULAR MEASURE 11
5.0 SYSTEM DIAGRAM AND SUBSYSTEM DEFINITION 12
5.1 X-RAY SOURCE SYSTEM 12
5.2 BEAM NORMALIZATION DETECTOR-500 12
5.3 GUIDE TUBE ASSEMBLY 12
5.4 INSTRUMENT CHAMBER ASSEMBLY 12
5.4.1 Optical Bench 13
5.4.2 Instrument Chamber 13
5.4.3 IC Rails 13
5.4.3.1 Test Bench Rails 13
5.4.3.2 GSE Rails 13
5.4.4 Test Benches 13
5.4.4.1 Source End Test Bench 14
5.4.4.2 Detector End Test Bench 14
5.4.4.2.1. X-ray Detector Assembly Support Structure 14
5.5 ACCESS PLATFORMS 14
5.5.1 Instrument Chamber Access Platforms 14
5.5.1.1 Source End 14
5.5.1.2 Detector End 15
5.5.2 Clean Room Work Platforms 15
5.5.3 Instrument Chamber Bridges 15
5.5.4 Bench Top Walkways for Grating Separation 15
5.6 CLEAN ROOM CRANE 15
5.6.1 Hook 16
5.7 CLEAN ROOM 16
5.8 INSTRUMENT UNLOADING DOCK 16
5.9 INSTRUMENT CHAMBER ROOM 16
5.9.1 1st Floor ICR 16
5.9.2 2nd Floor ICR 16
5.9.3 ICR Crane 16
5.9.4 Dumbwaiter 17
5.10 CONTROL ROOMS 17
5.10.1 2nd Floor Control Room 17
5.10.2 3rd Floor Control and Experimenter's Room 17
5.11 FACILITY 17
5.11.1 Vacuum System 17
5.11.2 AC Power 18
5.11.3 Thermal Control 18
5.11.4 IRIG Time Code 19
5.11.5 Data Local Area Network 19
5.11.6 SCATS 19
5.12 MOTION DETECTION SYSTEM 19
5.12.1 Optical Point Source 19
5.12.2 Source Pedestal 19
5.12.3 Data 20
5.13 OPTICAL ALIGNMENT SYSTEM 20
5.14 MASTER CONTROL COMPUTER 20
5.14.1 DLRS 20
5.14.2 Script Process 20
5.15 HIGH RESOLUTION MIRROR ASSEMBLY 21
5.15.1 MDS Lens 21
5.15.2 HRMA Thermal Controller 21
5.15.3 HRMA Support Structure 21
5.15.4 HRMA 21
5.16 HRMA SHUTTER ASSEMBLY 21
5.17 LETG INSERTION RETRACTION MECHANISM 22
5.18 HETG INSERTION RETRACTION MECHANISM 22
5.19 HRMA X-RAY DETECTION SYSTEM 22
5.19.1 Beam Normalization Detector-HRMA 22
5.19.2 X-ray Data Acquisition and Control System 22
5.19.3 Gas Supply System 22
5.19.4 HRMA X-ray Detector Assembly 23
5.20 SCIENCE INSTRUMENT MODULE FIVE AXIS MOUNT 23
5.20.1 FAM Controller 23
5.20.2 Cryo Shroud Assembly 23
5.21 HIGH ENERGY TRANSMISSION GRATING 23
5.22 LOW ENERGY TRANSMISSION GRATING 23
5.23 INTEGRATED SCIENCE INSTRUMENT MODULE 24
5.24 AXAF CCD IMAGING SPECTROMETER 24
5.24.1 ACIS Instrument 24
5.24.2 ACIS EGSE 24
5.25 HIGH RESOLUTION CAMERA 24
5.25.1 HRC Instrument 25
5.25.2 HRC EGSE 25
5.26 COMMAND TELEMETRY UNIT EMULATOR 25
5.27 DEEP SPACE SIMULATOR 25
5.28 X-RAY SURROGATE OPTIC 25
5.28.1 XSO 25
5.28.2 XSO MOUNT 25
5.29 Late ACIS Contingency Systems 26
5.29.1 ACIS Surrogate 26
5.29.2 ACIS-2C EGSE 26
5.29.3 Late ACIS Surrogate Z-Drive 26
5.29.4 LASS-Z Controller 26
6.0 INTERFACE DEFINITIONS 27
6.1 N-SQUARED DIAGRAM 27
6.2 INTERFACE DEFINITIONS 29
6.2.1 XSS-BND-H 29
6.2.1.1 Mechanical 29
6.2.2 XSS-BND-500 29
6.2.2.1 Mechanical 29
6.2.3 GTA-BND-500 29
6.2.3.1 Mechanical 29
6.2.3.1.1 Floor Space 29
6.2.3.1.2 Guide Tube Mounting 30
6.2.3.2 Electrical 30
6.2.3.3 Fluid 30
6.2.4 IC-HRMA 30
6.2.4.1 Mechanical 30
6.2.4.2 Contamination 30
6.2.4.3 HRMA Fluid 30
6.2.5 IC-Contamination Covers 31
6.2.5.1 Space Envelope 31
6.2.6 IC-HSS 31
6.2.6.1 Mechanical 31
6.2.6.2 Contamination 31
6.2.6.3 Electrical 31
6.2.7 IC-HRMA SHUTTER ASSEMBLY 31
6.2.7.1 Mechanical 31
6.2.7.2 Contamination 32
6.2.8 IC-LIRM 32
6.2.8.1 Mechanical 32
6.2.8.2 Contamination 32
6.2.9 IC-HIRM 32
6.2.9.1 Mechanical 32
6.2.9.2 Contamination 32
6.2.10 IC-GSS 32
6.2.10.1 HXDA Fluid 33
6.2.10.2 BND-H Fluid 33
6.2.11 IC-HXDA 33
6.2.11.1 Mechanical 33
6.2.11.2 Contamination 33
6.2.12 IC-BND-H 33
6.2.12.1 Mechanical 34
6.2.12.2 Contamination 34
6.2.13 IC-FAM 34
6.2.13.1 Mechanical 34
6.2.13.2 Contamination 34
6.2.14 IC-CSA 34
6.2.14.1 Mechanical 34
6.2.14.2 Contamination 34
6.2.14.3 Fluid 35
6.2.15 IC-FAM Control 35
6.2.15.1 Electrical 35
6.2.15.2 Contamination 35
6.2.16 IC-CTUE 35
6.2.16.1 Electrical 35
6.2.17 SETB-HRMA SS 35
6.2.17.1 Mechanical 35
6.2.18 DETB-FAM 35
6.2.18.1 Mechanical 36
6.2.19 XDASS-HXDA 36
6.2.19.1 Mechanical 36
6.2.20 SEAP-HRMA 36
6.2.20.1 Access 36
6.2.21 SEAP-HRMA SS 36
6.2.21.1 Access 36
6.2.22 SEAP-HRMA Purge Unit 36
6.2.22.1 Access 37
6.2.23 SEAP-HRMA SHUTTER ASSEMBLY 37
6.2.23.1 Access 37
6.2.24 SEAP-LIRM 37
6.2.24.1 Access 37
6.2.25 SEAP-HIRM 37
6.2.25.1 Access 38
6.2.26 SEAP-LETG 38
6.2.26.1 Access 38
6.2.27 SEAP-HETG 38
6.2.27.1 Access 38
6.2.28 DEAP-HXDA 38
6.2.28.1 Access 39
6.2.29 DEAP-FAM 39
6.2.29.1 Access 39
6.2.30 DEAP-CSA 39
6.2.30.1 Access 39
6.2.31 CRWP-HRMA 39
6.2.31.1 Access 39
6.2.32 CRWP-HRMA SS 40
6.2.32.1 Access 40
6.2.33 CRWP-HRMA SHUTTER ASSEMBLY 40
6.2.33.1 Access 40
6.2.34 CRWP-LIRM 40
6.2.34.1 Access 40
6.2.35 CRWP-HIRM 40
6.2.35.1 Access 41
6.2.36 CRWP-LETG 41
6.2.36.1 Access 41
6.2.37 CRWP-HETG 41
6.2.37.1 Access 41
6.2.38 CRWP-HXDA 41
6.2.38.1 Access 41
6.2.39 CRWP-FAM 42
6.2.39.1 Access 42
6.2.40 CRWP-CSA 42
6.2.40.1 Access 42
6.2.41 CRC-HRMA 42
6.2.41.1 Crane Operating Parameters 42
6.2.41.2 Hook Definition 42
6.2.42 CRC-HRMA SS 42
6.2.42.1 Crane Operating Parameters 43
6.2.42.2 Hook Definition 43
6.2.43 CRC-Shutter Assembly 43
6.2.43.1 Crane Operating Parameters 43
6.2.43.2 Hook Definition 43
6.2.44 CRC-LETG 43
6.2.44.1 Crane Operating Parameters 43
6.2.44.2 Hook Definition 43
6.2.45 CRC-HETG 43
6.2.45.1 Crane Operating Parameters 44
6.2.45.2 Hook Definition 44
6.2.46 CRC-HXDA 44
6.2.46.1 Crane Operating Parameters 44
6.2.46.2 Hook Definition 44
6.2.47 CRC-BND-H 44
6.2.47.1 Crane Operating Parameters 44
6.2.47.2 Hook Definition 44
6.2.48 CRC-FAM 44
6.2.48.1 Crane Operating Parameters 45
6.2.48.2 Hook Definition 45
6.2.49 CRC-CSA 45
6.2.49.1 Crane Operating Parameters 45
6.2.49.2 Hook Definition 45
6.2.50 CR-HRMA 45
6.2.50.1 Mechanical 45
6.2.50.1.1 Clean Room Floor 45
6.2.50.1.2 Clearance 45
6.2.50.2 Contamination 45
6.2.51 CR-HRMA SS 46
6.2.51.1 Mechanical 46
6.2.51.1.1 Clean Room Floor 46
6.2.51.1.2 Clearance 46
6.2.51.2 Contamination 46
6.2.52 CR-HRMA Purge Unit 46
6.2.53 CR-LIRM 46
6.2.53.1 Mechanical 46
6.2.53.1.1 Clean Room Floor 46
6.2.53.1.2 Clearance 46
6.2.53.2 Contamination 47
6.2.54 CR-HIRM 47
6.2.54.1 Mechanical 47
6.2.54.1.1 Clean Room Floor 47
6.2.54.1.2 Clearance 47
6.2.54.2 Contamination 47
6.2.55 CR-LETG 47
6.2.55.1 Mechanical 47
6.2.55.1.1 Clean Room Floor 47
6.2.55.1.2 Clearance 47
6.2.55.2 Contamination 48
6.2.56 CR-HETG 48
6.2.56.1 Mechanical 48
6.2.56.1.1 Clean Room Floor 48
6.2.56.1.2 Clearance 48
6.2.56.2 Contamination 48
6.2.57 CR-HXDA 48
6.2.57.1 Mechanical 48
6.2.57.1.1 Clean Room Floor 48
6.2.57.1.2 Clearance 48
6.2.57.2 Contamination 49
6.2.57.3 Clean Room Bulkhead 49
6.2.58 CR-BND-H 49
6.2.58.1 Mechanical 49
6.2.58.1.1 Clean Room Floor 49
6.2.58.1.2 Clearance 49
6.2.58.2 Contamination 49
6.2.58.3 Clean Room Bulkhead 49
6.2.59 CR-FAM 49
6.2.59.1 Mechanical 50
6.2.59.1.1 Clean Room Floor 50
6.2.59.1.2 Clearance 50
6.2.59.2 Contamination 50
6.2.59.3 Clean Room Bulkhead 50
6.2.60 CR-CSA 50
6.2.60.1 Mechanical 50
6.2.60.1.1 Clean Room Floor 50
6.2.60.1.2 Clearance 50
6.2.60.2 Contamination 50
6.2.60.3 Clean Room Bulkhead 51
6.2.61 CR-SIM 51
6.2.61.1 Mechanical 51
6.2.61.1.1 Clean Room Floor 51
6.2.61.1.2 Clearance 51
6.2.61.2 Contamination 51
6.2.61.3 Clean Room Bulkhead 51
6.2.62 IUD-HRMA 51
6.2.62.1 Mechanical 51
6.2.63 IUD-HRMA SS 52
6.2.63.1 Mechanical 52
6.2.64 IUD-LETG 52
6.2.64.1 Mechanical 52
6.2.65 IUD-HETG 52
6.2.65.1 Mechanical 52
6.2.66 IUD-HXDA 52
6.2.66.1 Mechanical 52
6.2.67 IUD-BND-H 53
6.2.67.1 Mechanical 53
6.2.68 IUD-FAM 53
6.2.68.1 Mechanical 53
6.2.69 IUD-CSA 53
6.2.69.1 Mechanical 53
6.2.70 IUD-SIM 53
6.2.70.1 Mechanical 53
6.2.71 1st FLOOR ICR-HRMA PURGE UNIT 54
6.2.71.1 Mechanical 54
6.2.71.2 Electrical Power 54
6.2.72 1st FLOOR ICR-GSS 54
6.2.72.1 Mechanical 54
6.2.72.2 Electrical Power 54
6.2.73 2nd FLOOR ICR-HRMA CONTROLLER 54
6.2.73.1 Floor Space 54
6.2.74 2nd FLOOR ICR-XDACS 55
6.2.74.1 Mechanical 55
6.2.75 2nd FLOOR ICR-FAM CONTROL 55
6.2.75.1 Mechanical 55
6.2.76 ICR CRANE-HRMA CONTROLLER 55
6.2.76.1 Crane Operating Parameters 55
6.2.76.2 Dumbwaiter 55
6.2.77 2nd FLOOR CONTROL ROOM-EKC HACS 55
6.2.77.1 Mechanical 56
6.2.77.2 Electrical Power 56
6.2.78 2nd FLOOR CONTROL ROOM-BND-H 56
6.2.78.1 Mechanical 56
6.2.78.2 Electrical Power 56
6.2.79 2nd FLOOR CONTROL ROOM-FAM EGSE 56
6.2.79.1 Mechanical 56
6.2.79.2 Electrical Power 56
6.2.80 2nd FLOOR CONTROL ROOM-CSA 56
6.2.80.1 Mechanical 57
6.2.80.2 Electrical Power 57
6.2.81 2nd FLOOR CONTROL ROOM-SIM 57
6.2.81.1 Mechanical 57
6.2.81.2 Electrical Power 57
6.2.82 2nd FLOOR CONTROL ROOM-ACIS EGSE 57
6.2.82.1 Mechanical 57
6.2.82.2 Electrical Power 57
6.2.83 2nd FLOOR CONTROL ROOM-HRC EGSE 57
6.2.83.1 Mechanical 58
6.2.83.2 Electrical Power 58
6.2.84 3rd FLOOR ROOM-LETG 58
6.2.84.1 Mechanical 58
6.2.84.2 Electrical Power 58
6.2.85 3rd FLOOR ROOM-HETG 58
6.2.85.1 Mechanical 58
6.2.85.2 Electrical Power 58
6.2.86 VACUUM SYSTEM-HRMA 58
6.2.86.1 Environmental 59
6.2.87 VACUUM SYSTEM-HRMA PURGE UNIT 59
6.2.87.1 High Voltage Enable 59
6.2.88 VACUUM SYSTEM-GSS 59
6.2.89 VACUUM SYSTEM-BND-500 59
6.2.90 UPS-EKC HACS 60
6.2.90.1 Electrical 60
6.2.91 UPS-HRMA SS 60
6.2.91.1 Electrical 60
6.2.92 UPS-XDACS 60
6.2.92.1 Electrical 60
6.2.93 UPS-SIM 60
6.2.93.1 Electrical 60
6.2.94 UPS-ACIS EGSE 61
6.2.94.1 Electrical 61
6.2.95 UPS-HRC EGSE 61
6.2.95.1 Electrical 61
6.2.96 UPS-CTUE 61
6.2.96.1 Electrical 61
6.2.97 IRIG-EKC HACS 61
6.2.97.1 Electrical 61
6.2.98 IRIG-XDACS 62
6.2.98.1 Electrical 62
6.2.99 IRIG-FAM EGSE 62
6.2.99.1 Electrical 62
6.2.100 IRIG-ACIS EGSE 62
6.2.100.1 Electrical 62
6.2.101 IRIG-HRC EGSE 62
6.2.101.1 Electrical 62
6.2.102 IRIG-CTUE 63
6.2.102.1 Electrical 63
6.2.103 LAN-EKC HACS 63
6.2.103.1 Cable Location 63
6.2.103.2 Address 63
6.2.103.3 Connector 63
6.2.104 LAN-EKC MCC TERMINAL 63
6.2.105 LAN-XDACS 63
6.2.105.1 Cable Location 63
6.2.105.2 Address 64
6.2.105.3 Connector 64
6.2.106 LAN-XDACS ANALYSIS 64
6.2.106.1 Cable Location 64
6.2.106.2 Address 64
6.2.106.3 Connector 64
6.2.107 LAN-BND-H 64
6.2.107.1 Cable Location 64
6.2.107.2 Address 64
6.2.107.3 Connector 64
6.2.108 LAN-BND-500 65
6.2.108.1 Cable Location 65
6.2.108.2 Address 65
6.2.108.3 Connector 65
6.2.109 LAN-FAM EGSE 65
6.2.109.1 Cable Location 65
6.2.109.2 Address 65
6.2.109.3 Connector 65
6.2.110 LAN-ACIS EGSE 65
6.2.110.1 Cable Location 66
6.2.110.2 Address 66
6.2.110.3 Connector 66
6.2.111 LAN-ACIS ARCHIVE 66
6.2.111.1 Cable Location 66
6.2.111.2 Address 66
6.2.111.3 Connector 66
6.2.112 LAN-ACIS ANALYSIS 66
6.2.112.1 Cable Location 66
6.2.112.2 Address 67
6.2.112.3 Connector 67
6.2.113 LAN-HRC EGSE 67
6.2.113.1 Cable Location 67
6.2.113.2 Address 67
6.2.113.3 Connector 67
6.2.114 LAN-HRC ARCHIVE 67
6.2.114.1 Cable Location 67
6.2.114.2 Address 67
6.2.114.3 Connector 67
6.2.115 LAN-HRC ANALYSIS 68
6.2.115.1 Cable Location 68
6.2.115.2 Address 68
6.2.115.3 Connector 68
6.2.116 LAN-CTUE 68
6.2.116.1 Cable Location 68
6.2.116.2 Address 68
6.2.116.3 Connector 68
6.2.117 LAN-ASC 68
6.2.117.1 Cable Location 69
6.2.117.2 Address 69
6.2.117.3 Connector 69
6.2.118 OPS-MDS LENS 69
6.2.119 OPS-LETG 69
6.2.119.1 Optical 69
6.2.120 OPS-HETG 69
6.2.120.1 Optical 69
6.2.121 OPS-BND-H 69
6.2.121.1 Optical 70
6.2.121.2 Optical 70
6.2.122 OAS-FIDUCIAL LIGHTS 70
6.2.123 OAS-ARM 70
6.2.124 OAS-CONTAMINATION COVERS 70
6.2.125 OAS-SHUTTER ASSEMBLY 70
6.2.126 OAS-LETG 70
6.2.126.1 Optical 70
6.2.127 OAS-HETG 71
6.2.127.1 Optical 71
6.2.128 OAS-HXDA 71
6.2.129 OAS-FAM 71
6.2.129.1 Fiducial Lights 71
6.2.129.2 Alignment Mirror 71
6.2.130 OAS-SIM 71
6.2.131 VACUUM SYSTEM-GSS 71
6.2.131.1 Environmental 72
6.2.132 VACUUM SYSTEM-BND-H 72
6.2.132.1 Environmental 72
6.2.133 IC-HXDA 72
6.2.133.1 Mechanical 72
6.2.133.2 Electrical 72
6.2.133.3 Contamination 72
6.2.134 VACUUM SYSTEM-HXDA 73
6.2.134.1 Environmental 73
6.2.135 IC-BND-H 73
6.2.135.1 Mechanical 73
6.2.135.2 Electrical 73
6.2.135.3 Contamination 73
6.2.136 TBR-BND-H 73
6.2.136.1 Mechanical 73
6.2.137 CRC-BND-H 74
6.2.137.1 Crane Operating Parameters 74
6.2.137.2 Hook Definition 74
6.2.138 CR-BND 74
6.2.138.1 Mechanical 74
6.2.138.1.1 Clean Room Floor 74
6.2.138.1.2 Clearance 74
6.2.138.2 Contamination 74
6.2.139 IC-FAM 74
6.2.139.1 IC-FAM Interface-Electrical 75
6.2.139.2 CSA Fluid 75
6.2.139.3 Space Allocation 75
6.2.139.4 Contamination 75
6.2.140 VACUUM SYSTEM-FAM 75
6.2.141 OAS-FAM 75
6.2.141.1 Fiducial Lights 75
6.2.141.2 Alignment Mirror 75
6.2.142 IUD-FAM EGSE 76
6.2.142.1 Mechanical 76
6.2.143 ICR Crane-FAM EGSE 76
6.2.143.1 Crane Operating Parameters 76
6.2.143.2 Dumbwaiter 76
6.2.144 FAM EGSE - DLRS 76
6.2.144.1 Connection 76
6.2.144.2 Record Content 76
6.2.145 FAM EGSE - Test Conductor Workstation 77
6.2.145.1 Connection 77
6.2.145.2 Content 77
6.2.146 VACUUM SYSTEM-LETG 77
6.2.146.1 Environmental 77
6.2.147 LIRM-LETG 77
6.2.147.1 Mechanical 77
6.2.148 VACUUM SYSTEM-HETG 77
6.2.148.1 Environmental 78
6.2.149 HIRM-HETG 78
6.2.149.1 Mechanical 78
6.2.150 ICR CRANE-ACIS EGSE 78
6.2.150.1 Crane Operating Parameters 78
6.2.150.2 Dumbwaiter 78
6.2.151 ACIS EGSE - DLRS 78
6.2.151.1 Connection 78
6.2.151.2 Record Content 79
6.2.152 ACIS EGSE - Test Conductor Workstation 79
6.2.152.1 Connection 79
6.2.152.2 Content 79
6.2.153 ICR CRANE-HRC EGSE 79
6.2.153.1 Crane Operating Parameters 79
6.2.153.2 Dumbwaiter 79
6.2.154 HRC EGSE - DLRS 79
6.2.154.1 Connection 80
6.2.154.2 Record Content 80
6.2.155 HRC EGSE - Test Conductor Workstation 80
6.2.155.1 Connection 80
6.2.155.2 Content 80
6.2.156 SIM-CTUE 80
6.2.156.1 Connection 80
6.2.156.2 Commands 80
6.2.156.3 Data 81
6.2.157 ACIS EGSE - CTUE 81
6.2.157.1 Connection 81
6.2.157.2 Commands 81
6.2.157.3 Data 81
6.2.158 HRC EGSE - CTUE 81
6.2.158.1 Connection 81
6.2.158.2 Commands 81
6.2.158.3 Data 82
6.2.159 CTUE-DLRS 82
6.2.159.1 Connection 82
6.2.159.2 Content 82
6.2.159.2.1 MCC Header 82
6.2.160 HRMA-DSS 82
6.2.160.1 Mechanical 82
6.2.161 XSO-XSO Mount 82
6.2.162 XDACS - HSA 83
6.2.162.1 Mechanical 83
6.2.162.2 Location 83
6.2.162.3 Electrical 83
6.2.162.4 Signals 84
6.2.162.4.1 Command Signals 84
6.2.162.4.2 Status Signals 85
6.2.163 MDS Source - X-ray Beam 85
6.2.164 XSS Computer - Test Conductor Workstation 85
6.2.164.1 Connection 85
6.2.164.2 Content 85
6.2.165 GTA - GSS 85
6.2.165.1 Mechanical 85
6.2.165.2 Fluid 85
6.2.166 IC - RCMS 85
6.2.166.1 Mechanical 86
6.2.167 IC - HRMA Controller 86
6.2.167.1 Mechanical 86
6.2.167.2 Contamination 86
6.2.168 IC - LETG 86
6.2.168.1 Mechanical 86
6.2.168.2 Contamination 86
6.2.169 IC - HETG 86
6.2.169.1 Mechanical 86
6.2.169.2 Contamination 86
6.2.170 IC - LASS-Z 87
6.2.170.1 Mechanical 87
6.2.170.2 Contamination 87
6.2.171 IC - SIM 87
6.2.171.1 Mechanical 87
6.2.171.2 Contamination 87
6.2.172 IC - ACIS 87
6.2.172.1 Mechanical 87
6.2.172.2 Contamination 87
6.2.173 IC - ACIS-2C 88
6.2.173.1 Mechanical 88
6.2.173.2 Contamination 88
6.2.174 IC - HRC 88
6.2.174.1 Mechanical 88
6.2.174.2 Contamination 88
6.2.175 SETB - HRMA Controller 88
6.2.175.1 Mechanical 88
6.2.176 DETB - MDS SAT 88
6.2.176.1 Mechanical 88
6.2.177 DETB - HXDA 89
6.2.177.1 Mechanical 89
6.2.178 XDASS - OPS 89
6.2.178.1 Mechanical 89
6.2.179 XDASS - HXDA 89
6.2.179.1 Mechanical 89
6.2.180 DEAP - CSA 89
6.2.180.1 Access 89
6.2.181 CRWP - HPU 89
6.2.181.1 Access 90
6.2.182 BTWNGS - LETG 90
6.2.182.1 Access 90
6.2.183 BTWNGS - HETG 90
6.2.183.1 Access 90
6.2.184 CRC - LASS-Z 90
6.2.184.1 Crane Operating Parameters 90
6.2.184.2 Hook Definition 90
6.2.185 CRC - SIM 90
6.2.185.1 Crane Operating Parameters 91
6.2.185.2 Hook Definition 91
6.2.186 CR - LASS-Z 91
6.2.186.1 Mechanical 91
6.2.186.1.1 Clean Room Floor 91
6.2.186.1.2 Clearance 91
6.2.186.2 Contamination 91
6.2.187 IUD - BND-500 91
6.2.187.1 Mechanical 91
6.2.188 ICR Crane - Contamination Covers 91
6.2.188.1 Crane Operating Parameters 91
6.2.188.2 Dumbwaiter 92
6.2.189 ICR Crane - LASS-Z 92
6.2.189.1 Crane Operating Parameters 92
6.2.189.2 Dumbwaiter 92
6.2.190 ICR Crane - SIM 92
6.2.190.1 Crane Operating Parameters 92
6.2.190.2 Dumbwaiter 92
6.2.191 2nd Floor Control Room - XDACS 92
6.2.191.1 Mechanical 92
6.2.191.2 Electrical Power 92
6.2.192 2nd Floor Control Room - FAM 93
6.2.192.1 Mechanical 93
6.2.192.2 Electrical Power 93
6.2.193 2nd Floor Control Room - LASS-Z 93
6.2.193.1 Mechanical 93
6.2.193.2 Electrical Power 93
6.2.194 2nd Floor Control Room - ACIS Data Check W/S 93
6.2.194.1 Mechanical 93
6.2.194.2 Electrical Power 93
6.2.195 2nd Floor Control Room - CTUE 93
6.2.195.1 Mechanical 93
6.2.195.2 Electrical Power 94
6.2.196 3rd Floor Room - XDACS 94
6.2.196.1 Mechanical 94
6.2.196.2 Electrical Power 94
6.2.197 3rd Floor Room - XDACS Analysis 94
6.2.198 3rd Floor Room - ACIS 94
6.2.198.1 Mechanical 94
6.2.198.2 Electrical Power 94
6.2.199 3rd Floor Room - ACIS-2C 94
6.2.199.1 Mechanical 94
6.2.199.2 Electrical Power 94
6.2.200 3rd Floor Room - HRC Analysis 95
6.2.200.1 Mechanical 95
6.2.200.2 Electrical Power 95
6.2.201 Vacuum System - CSA 95
6.2.202 UPS - LASS-Z 95
6.2.202.1 Electrical 95
6.2.203 EPS - HRMA 95
6.2.203.1 Electrical 95
6.2.204 EPS - Fiducial Lights 95
6.2.204.1 Electrical 96
6.2.205 EPS - XDACS Analysis 96
6.2.205.1 Electrical 96
6.2.207 IRIG - DLRS Retreive 96
6.2.207.1 Electrical 96
6.2.208 IRIG - DLRS Archive 96
6.2.208.1 Electrical 96
6.2.209 IRIG - TC W/S 96
6.2.209.1 Electrical 96
6.2.210 IRIG - GSS 96
6.2.210.1 Electrical 97
6.2.211 IRIG - BND-H 97
6.2.211.1 Electrical 97
6.2.212 IRIG - BND-500 97
6.2.212.1 Electrical 97
6.2.213 LAN - OAS 97
6.2.213.1 Cable Location 97
6.2.213.2 Address 97
6.2.213.3 Connector 97
6.2.214 LAN - DLRS Archive 98
6.2.214.1 Cable Location 98
6.2.214.2 Address 98
6.2.214.3 Connector 98
6.2.215 LAN - DLRS Archive 98
6.2.215.1 Cable Location 98
6.2.215.2 Address 98
6.2.215.3 Connector 98
6.2.216 LAN - Test Conductor Workstation 98
6.2.216.1 Cable Location 98
6.2.216.2 Address 99
6.2.216.3 Connector 99
6.2.217 LAN - GSS 99
6.2.217.1 Cable Location 99
6.2.217.2 Address 99
6.2.217.3 Connector 99
6.2.218 LAN - ACIS Data Check W/S 99
6.2.218.1 Cable Location 99
6.2.218.2 Address 99
6.2.218.3 Connector 99
6.2.219 LAN - 3rd Floor Analysis 100
6.2.219.1 Cable Location 100
6.2.219.2 Address 100
6.2.219.3 Connector 100
6.2.220 LAN - Internet 100
6.2.221 IRIG - BND-H 100
6.2.221.1 Electrical 100
6.2.222 IRIG - BND-500 100
6.2.222.1 Electrical 100
6.2.225 MCC Archive - XDACS Analysis 101
6.2.225.1 Connection 101
6.2.226 MCC Archive - ACIS Analysis 101
6.2.226.1 Connection 101
6.2.228 MCC Archive - Internet 101
6.2.229 MCC DLRS - EKC HACS 101
6.2.229.1 Connection 101
6.2.229.2 Record Content 101
6.2.230 MCC DLRS - XDACS 102
6.2.230.1 Connection 102
6.2.230.2 Record Content 102
6.2.231 Test Conductor Workstation - EKC HACS 102
6.2.231.1 Connection 102
6.2.231.2 Content 102
6.2.232 Test Conductor Workstation - XDACS 102
6.2.232.1 Connection 102
6.2.232.2 Content 102
6.2.233 Test Conductor Workstation - Internet 103
6.2.234 Test Conductor Workstation - CTL/XC03 103
6.2.236 HRMA - Contamination Covers 103
6.2.237 HRMA - LETG 103
6.2.237.1 Optical 103
6.2.238 HRMA - HETG 103
6.2.238.1 Optical 103
6.2.252 ACIS Analysis - Internet 103
6.2.253 HRC Analysis - Internet 104
6.2.254 ASC - Internet 104
6.2.255 3rd Floor Analysis - Internet 104
6.2.256 2nd FLOOR CONTROL ROOM - EKC TMaCS 104
6.2.256.1 Mechanical 104
6.2.256.2 Electrical Power 104
6.2.257 UPS - EKC TMaCS 104
6.2.257.1 Electrical 104
6.2.258 IRIG - EKC TMaCS 104
6.2.258.1 Electrical 105
6.2.259 LAN - EKC TMaCS 105
6.2.259.1 Cable Location 105
6.2.259.2 Address 105
6.2.259.3 Connector 105
6.2.260 FAM Dither Control 105
7.0 ACRONYMS 107
Appendix A - Wire Interface Database 1
Appendix B-MCC Data Records Structures 1
Appendix C-Calibration Test List Database Definition 1
1.0 SCOPE
This document is the second of two volumes. The first volume defines the
interfaces relevant to the X-ray testing of the Advanced X-ray
Astrophysics Facility (AXAF) Verification Engineering Test Article I
(VETA-I), while this volume is concerned with the High Resolution Mirror
Assembly (HRMA) and the Focal Plane Science Instruments (FPSI).
There is a second book comprised of standard engineering drawings
precisely defining the relevant equipment and interfaces. This book is
called XC05 Book 2, with place holders where appropriate for undefined
hardware.
It is the purpose of this document to define the interfaces among the
various team- member-supplied equipment necessary to support a successful
HRMA/Science Instrument (SI) calibration. The X-ray testing is to be
carried out at the X-ray Calibration Facility (XRCF) at Marshall Space
Flight Center (MSFC). By providing the definition of the various
interfaces, this document is intended to serve as a foundation for
control of the interfaces for the HRMA test to be conducted at the MSFC
XRCF.
1.1 TEAM MEMBERS
This section introduces the team members for the HRMA/SI calibration
activity and their roles.
1.1.1 MSFC
The MSFC team has the responsibility for operation of the x-ray
calibration facility (XRCF) and all resident support services. The MSFC
team also provides a Test Director who is directly responsible for the
safety of the XRCF and flight hardware.
MSFC will also provide facility data, detailing the vacuum level,
temperature via the SCATS/PACRATS system and motion detection system
(MDS) aspect data.
1.1.2 SAO
The SAO team has responsibility for the operation of the HRMA x-ray
detector system, (HXDS), the beam normalization detector (BND-H), the
beam normalization detector at area 500 (BND-500) and the operation of
the HRMA shutter assembly. Also under the purview of the SAO team is
analysis of the HRMA calibration data collected by the HXDS, BND-H and
BND-500. SAO is also responsible for the integration and checkout of the
HXDS, BND-H and BND-500.
SAO is also responsible for the operation of the BND-H and BND-500 during
calibration of the science instruments (SIs).
1.1.3 TRW
TRW has the responsibility for conducting the calibration activity of the
HRMA and science instruments.
TRW is also providing the command telemetry unit emulator (CTUE) for use
during x-ray calibration.
1.1.4 EKC
The Eastman Kodak Company (EKC) provides and operates the HRMA, and
gravity off- loading apparatus HRMA controls, the objective transmission
grating (OTG) mounting interfaces, spacers and motors.
1.1.5 BASD
Ball Aerospace Systems Division (BASD) provides and operates the
integrated science instrument module (ISIM) and the SIM five axis mount
(FAM) and the cryoshroud assembly (CSA).
1.1.6 FPSIs
There are two focal plane science instruments (FPSI) that will be
installed in the SIM for calibration at the XRCF.
1.1.6.1 High Resolution Camera
The High Resolution Camera (HRC) team is responsible for the operation
maintenance of the HRC and the acquisition and analysis of the data
collected by this instrument during calibration.
1.1.6.2 AXAF CCD Imaging Spectrometer
The AXAF CCD Imaging Spectrometer (ACIS) team is responsible for the
operation maintenance of the ACIS and the acquisition and analysis of
the data collected by this instrument during calibration.
1.1.7 Objective Transmission Gratings
The objective transmission gratings (OTG) consist of two separate
transmission grating assemblies, the high energy transmission grating and
the low energy transmission grating The OTGs are located aft of the HRMA
and are moved in and out of the focused beam by means of remotely
controlled actuators supplied by EKC.
1.1.7.1 High Energy Transmission Grating
The high energy transmission grating (HETG) is provided by MIT and
consists of grating elements with two different line spacings for
different energy regions. The approximate energy bands are 0.4 to 4.0
keV and 0.9 to 8 keV and the associated gratings are called the medium
energy grating (MEG) and the high energy grating (HEG).
The HETG team is responsible for the acquisition and analysis of the data
collected in concert with any and all of the focal plane instruments by
this OTG during calibration.
1.1.7.2 Low Energy Transmission Grating
The low energy transmission grating (LETG) is provided by Space Research
Organization of the Netherlands (SRON). The LETG grating has an
approximate spectral range from 0.09 keV to 4.1 keV.
The LETG team is responsible for the acquisition and analysis of the data
collected in concert with any and all of the focal plane instruments by
this OTG during calibration.
2.0 APPLICABLE DOCUMENTS
This section lists the applicable documents divided into two broad
categories. The categories are team member controlled documents and
general governmental specifications. The team member controlled
documents are HRMA X-ray testing specific; the general specifications are
generic. Unless otherwise stated, the latest revision of the document
cited below is the correct version. In the case of an ambiguity between
the referenced document and this document, this document is
authoritative.
2.1 REQUIRED DOCUMENTS
2.1.1 Team Member Documents
MSFC
MSFC-SPEC-2279 AXAF Master Control Computer
(MCC) System Requirements Specification
MSFC-RQMT-2229 Scientific Requirements for AXAF-I Calibration
MSFC-SPEC-2401 End Item Specification for the X-ray Calibration
Facility X-ray Source System
MSFC-SPEC-1838 AXAF X-ray Calibration Facility Requirements
MSFC-SPEC-1839 AXAF X-ray HRMA/SI Calibration Requirements
FAC-EJ-4708 XRCF Specification and Drawing Package
EQ16-0057 Equipment Specification for Command
Telemetry Unit Emulator
TRW
DPD 692 SE28 AXAF Contamination and Control Plan
DPD 692 XC01 HRMA/SI Calibration Test Plan
DPD 692 XC02 HRMA/SI Calibration Test Requirements
DPD 692 SE17 Instrumentation Program and Command List (IP&CL)
SAO
SAO-AXAF-DR-92-017 HXDA CEI Specification
EKC
EK-5003-100 HRMA Detail Specification
2.1.2 Governmental Specifications
Federal
FED-STD-209 Clean Room and Work Station Requirements,
Controlled Environment
Military
MIL-STD-1246 Product Cleanliness and Contamination Control
Program
2.1.3 Drawings
TRW
Note, these drawings are collected as Book 2 to this document.
E445700 HRMA X-ray Calibration, Space
Allocation and Interface
E445703 Alignment Chamber Port
Configuration
E445704 Reach and Access, MDS
Configuration
E445705 Reach and Access, OTG and OTG ARM
E445706 Reach and Access, HRMA Alignment
Configuration
E445708 XRCF Electrical Power and
Signaling Interface
E445709 HRMA Staging and XRCF Floor Space
Allocation
E445782 XRCF Interfaces (N2 Chart)
E445900 MCC Command and Data Flow Block
Diagram
E445901 Building 500 Interfaces
E445902 HRMA Envelope
E445904 HRMA Thermal Balance Test
Configuration
E445905 XRCF Coordinate System
E445906 Electrical I/F HRMA and HRMA & SI
Calibration
E445908 MDS Coordinate System and Sign
Convention
E445909 HRMA Shutter Blade Designations
E445910 Alignment Telescope Coordinate
System
E445911 Deep Space Simulator
E445912 HRMA/SI X-ray Calibration, Space
Allocation and Interface
E445913 MDS-FAM Interface
E445914 OTG Reach and Access
E445916 HRMA Pre-Calibration
Configuration: XSO-HXDS
E445917 XRCF Guide Tube Baffle
E445918 Access Platform, OTG Cover
Removal
E445919 Alignment Reference Mirror XRCF
Test
E445920 Alignment Reference Mirror XRCF
Test, Assy
E445921 HRMA Calibration MCC I/F
E445922 HRMA/SI Calibration MCC I/F
E445923 Instrument Chamber External Fluid Interface
E445924 Instrument Chamber Monorail Interface
E445925 Clean Room Bulkhead
E445926 X-ray Keep Out Zone, DETB
E445927 BLDG-500 Second Floor Plan
E445928 MDS Lens Assembly/MASS Interface
E445929 CTUE to Vacuum Chamber Mechanical
Interface
E445930 CTUE Vacuum I/F Cable
E445931 MDS Light Interface
E445932 CTUE Vacuum I/F Cable XRCF
E445933 Coordinate Systems at XRCF
E445934 Interface Control Drawing - Broom
Magnets
E445935 AXAF Electron Sweep Magnet
E445937 Late ACIS Surrogate
E445938 AXAF HRC Alignment Reference
Mirror
301331 ICD - Objective Transmission
Grating (OTG), AXAF - I
3.0 COORDINATE SYSTEMS
There are many coordinate systems used in the execution of x-ray test
activities. It is important that the relationships among the various
systems be well understood in order to facilitate proper and accurate
communication among team members.
3.1 XRCF
There are two facility coordinate systems that will be referenced in this
document. The first is called the XRCF coordinate system and is based on
facility characteristics and is used to describe locations both in the IC
and the source building. The second is denoted as the architectural
coordinate system and is derived from the architectural and engineering
drawings of the XRCF and is used to describe the location of various
elements of the facility in terms of their location along an east-west
line.
3.1.1 Architectural Coordinate System
The architectural coordinate system (ACS) is based upon surveying datum
used in the design of the XRCF. The ACS is based on stations (STA)
located 100 feet apart on the guide tube (GT) centerline. The west end
of the GT is denoted as STA 27+01.5 and the station number decreases to
the east. This coordinate system is shown in DWG E445917 and is used
primarily to assign positions of GT features.
3.1.2 XRCF Coordinate System
The XRCF coordinate system is an orthogonal right handed system. The +Z-
axis is antiparallel to the force of gravity (i.e., up), the + X-axis is
directed along the facility optical axis (FOA) (i.e., from the Instrument
Chamber toward the Source Building) and the +Y-axis is found by
completing the right hand system. (Ref.: This + Y-axis will point south,
from the Instrument Chamber toward the Control Room.) The X-Y plane lies
105.75 _ 0.05 inches above the plane defined by the tops of the optical
bench piers. The X-Z plane bisects the line segment connecting the
centers of the third pair of optical bench piers, where the piers are
connected from the source end of the chamber. Finally, the Y-Z plane is
defined by the two centerlines of the third piers from the source end of
the instrument chamber and lies 48.00 inches from each pier centerline.
The XRCF Coordinate System is defined in DWG E445905.
3.2 MDS Coordinate System
The MDS coordinate system is used to reckon the relative motion data
reported by the MDS. The axes of the MDS coordinate system are parallel
to but displaced from the XRCF coordinate system defined above.
The MDS X axis is parallel to the XRCF X axis and is defined by the line
in the XRCF coordinate system Y=-2.75 inches, Z=-4.76 inches. The MDS Y
and Z axes are parallel to the respective XRCF axis. The MDS origin is
at the OPS, located proximate to the focal plane of the HRMA. The
displacement of the origin is irrelevant since the MDS can only reckon
relative motion in the MDS or XRCF (Y,Z) plane.
The sense of the relative motions as reported by the MDS is given in DWG
E445908.
3.3 ATA Coordinate System
The alignment telescope assembly (ATA) coordinate system is defined when
the ATA is used as an autocollimator to measure the HRMA line of sight
(LOS) is shown in DWG E445910. The ATA measures the rotation angle of
the normal to the alignment reference mirror (ARM) about the XRCF Y axis,
Y, and the rotation about the XRCF Z axis, Z. The correctly reckoned
signs for the rotations are shown in DWG E445910, corresponding to the
two rotation angles when viewed through the ATA eyepiece reticule.
3.4 SCIENCE INSTRUMENT MODULE FIVE AXIS MOUNT
The coordinate system for the SIM FAM is TBD.
3.5 HRMA
The coordinate system for the HRMA is defined in EK-5003-100, section
3.3.11 and Figure 3.3.11-1.
3.6 HRMA X-ray Detection System
The HXDA coordinate system has its axes parallel to the corresponding
axes of the XRCF coordinate system. The origin of the HXDA coordinate
system is located per SAO- AXAF-92-017.
4.0 UNITS
It is desired that all team members use the same units in order to
facilitate unambiguous and accurate communication.
4.1 TIME
Time will be reckoned in universal time (UT). The XRCF will provide an
IRIG B signal so that all team members may synchronize to it. Please
note, that synchronization requires some sort of IRIG code reader. All
computer system clocks should be set to UT so that all file generation
times are reckoned in the same time zone.
4.2 TEMPERATURE
Temperature will be measured and reported in degrees Fahrenheit (¡F).
4.3 LENGTH
All lengths shall be reported in feet and inches.
4.4 ANGULAR MEASURE
Angular measure will be reported in degrees, minutes and seconds of arc.
5.0 SYSTEM DIAGRAM AND SUBSYSTEM DEFINITION
This section contains equipment descriptions.
5.1 X-RAY SOURCE SYSTEM
The x-ray source system (XSS) produces the x-ray test beam that is
incident on the HRMA. This system is described by MSFC-SPEC-2401.
This subsystem is provided by MSFC.
5.2 BEAM NORMALIZATION DETECTOR-500
The BND-500 will be located at approximately STA 25+78.5. The BND-500
will consist of detectors to characterize the beam and control the XSS.
The BND-500 will be supplied by SAO.
5.3 GUIDE TUBE ASSEMBLY
The guide tube assembly (GTA) includes the 1701.5 ft. long GT, baffles
and gate valve and guide tube vacuum system (GVS).
This item is part of the XRCF and is provided by MSFC.
The GTA includes the 1701.5 ft. long vacuum tube that runs from the X-ray
generator building in an east-west direction from the source building to
the instrument chamber, the vacuum gate valves, the six x-ray baffles and
all man access ports. The gates valves are controlled via the XRCF
facility controller and allow for atmospheric pressure in the event it is
required in any one of the four main vacuum subsections.
5.4 INSTRUMENT CHAMBER ASSEMBLY
The instrument chamber assembly consists of the optical bench, instrument
chamber vacuum subsystem, instrument chamber (IC), test bench rails (TBR)
and GSE rails, and internal walkways and access platforms (AP).
This item will be provided by MSFC.
The instrument chamber vacuum subsystems (ICVS) can be controlled
manually or automatically, and are continuously monitored in the X-ray
facility control room. Cryogenic traps will be located between the
mechanical pumps and the evacuated volumes. Roughing and pumping system
components are to be housed in environmentally controlled buildings to
protect them from the weather. All high vacuum pumps shall be cryogenic
pumps and half of the cryogenic pumps shall be equipped with isolation
valves to allow regeneration of the pumps as required. All pumps are
vibration isolated from the vacuum vessel.
5.4.1 Optical Bench
The optical bench (OB) provides a stable platform for supporting the test
benches. The OB consists of a concrete foundation and 22 stainless steel
(304 CRES) piers that penetrate the IC. The piers are 18 inches in
diameter and 8 feet high.
Repressurization is performed with filtered missile grade air at
controlled rates using gas baffles to minimize air velocities during the
backfilling operation. The backfilling is controlled by the facility's
proportional integral derivative control system to a predetermined
temporal pressurization profile. All vacuum vessels will contain lift
plates or other pressure relief systems to prevent overpressurization.
5.4.2 Instrument Chamber
The IC encloses the test volume to be evacuated. The IC includes the 24
ft. ID by 75 ft. long vacuum enclosure and the thermal panels.
5.4.3 IC Rails
The IC rails consist of the test bench rails (TBR) and the GSE rails
described below.
5.4.3.1 Test Bench Rails
The TBR are used to translate hardware and test benches in and out of the
IC. The TBR extend out of the IC to allow hardware to be placed on the
rails/benches by the clean room crane.
5.4.3.2 GSE Rails
The GSE rails are used to support the internal access platforms (AP).
5.4.4 Test Benches
The test benches are two identical structures that support test hardware
inside the IC. The test benches are structures that roll into the
instrument chamber on the TBR into their nominal test positions and are
then, by the use of jacking devices, lifted off the rails onto four
optical bench support piers.
These test benches are to be supplied by MSFC.
5.4.4.1 Source End Test Bench
The source end test bench (SETB) is the platform upon which the HRMA is
mounted. This will place the HRMA optical axis in close proximity to the
X-ray beam centerline for the final HRMA alignment.
5.4.4.2 Detector End Test Bench
The detector end test bench (DETB) is the platform upon which the XDA
support structure (XDASS), MDS source pedestal the XDA patch panel stand
and SIM FAM are mounted.
5.4.4.2.1. X-ray Detector Assembly Support Structure
This XDASS is a static structure which locates the HXDA at the proper
height.
This structure is to be provided by MSFC.
5.5 ACCESS PLATFORMS
Access to the hardware and GSE is facilitated by the APs. The AP are
located in the clean room and inside the IC.
5.5.1 Instrument Chamber Access Platforms
The instrument chamber access platforms (ICAP) are two identical APs for
use inside the chamber are mobile scaffolding structures with movable
platforms, and are motile via the GSE rails. Moreover, these platforms
are vacuum compatible butand are not left in the IC during evacuation.
5.5.1.1 Source End
The ICAP allows for access to the SETB and its resident hardware is known
as the source end access platform (SEAP).
The bridges and work platforms may also be withdrawn from the IC on the
GSE rails extensions. However, removal of the ICAP from the IC is not
part of the anticipated test plan.
5.5.1.2 Detector End
Similarly the AP allowing access to the DETB and its resident hardware is
the detector end access platform (DEAP).
The bridges and work platforms may also be withdrawn from the IC on the
GSE rails extensions.
5.5.2 Clean Room Work Platforms
The clean room work platform (CRWP) is a stationary scaffolding system
which resides on the XRCF Clean Room floor, and expedites access to GSE
which is mounted on the TBs on the TB rails in the Clean Room. The CRWP
is clean room compatible with grating platforms to retain the laminar
downdraft flow.
5.5.3 Instrument Chamber Bridges
There are two bridges that allow personnel to walk from the north to the
south side of the chamber in a safe and easy manner. These railed
walkways are mobile and vacuum compatible.
5.5.4 Bench Top Walkways for Grating Separation
These are two platforms attached to the Source End Test Bench adjacent to
the HRMA to provide reach and access to the OTGs for OTG contamination
cover removal, as shown in drawings E445700, E445914, and E445918.
5.6 CLEAN ROOM CRANE
The clean room crane is a 20 ton capacity overhead bridge crane used for
removing and installing heavy hardware. The working area of the crane is
shown in DWG E445709 Sheet 1.
Table 5.6 - Clean Room Crane Operating Parameters
MAXIMUM HOOK ELEVATION 644.5 FT
MINIMUM HOOK ELEVATION 607.5 FT
CLEAN ROOM FLOOR ELEVATION 614.0 FT
AVAILABLE LIFT 37.5 FT
HOOK LIFT SPEEDS 1.5, 3, 7, 10 FPM
TROLLEY SPEEDS 1.5, 5.0, 15, 25 FPM
LIFT CAPACITY 20 TONS
5.6.1 Hook
A drawing of the clean room crane hook is given in DWG E445705 sheet
3.
5.7 CLEAN ROOM
The clean room is comprised of three distinct rooms. Each area has a
sequentially higher level of cleanliness from the receiving area to
the IC. All areas that are maintained to class 10K or better per FED-
STD-209 are considered to be a clean room.
5.8 INSTRUMENT UNLOADING DOCK
The instrument unloading dock (IUD) is the covered outdoor area shown
to the east of the clean rooms on DWG E445709. The IUD has a
hydraulically actuated platform to facilitate hardware unloading.
5.9 INSTRUMENT CHAMBER ROOM
The instrument chamber room (ICR) consists of the first floor ICR,
the second floor ICR and the ICR crane. The ICR is not a clean area
but is temperature controlled per MSFC-SPEC-1837.
5.9.1 1st Floor ICR
This room is the location of the XRCF electrical and fiber optic
(F/O) patch panels.
5.9.2 2nd Floor ICR
The second floor ICR houses the team member special test equipment
(STE) racks.
5.9.3 ICR Crane
The ICR crane is intended to raise and lower team member equipment
racks to and from the second floor ICR. The operating parameters are
given in the table below.
There are two means of raising and lowering hardware from the first
floor, via hook and lifting straps and the other is via the
dumbwaiter. The former method is most often used for large or bulky
items and the dumbwaiter is used for more regular objects such as
racks and small pieces of equipment.
Table 5.9.3 - ICR Crane Operating Parameters
Maximum Hook Elevation 659.917 ft
Minimum Hook Elevation 619.917 ft
1st Floor ICR Elevation 614.0 ft
2nd Floor ICR Elevation 628.0 ft
Available Lift 40.0 ft
Hook Lift Speeds 8, 24 fpm
Trolley Speeds 17, 50 fpm
Lift Capacity with hook 1 ton
Lift Capacity with dumbwaiter 500 lbs
2nd Floor Opening 5 ft x 7 ft
5.9.4 Dumbwaiter
Sketches of the dumbwaiter are given in DWG E4457095.
5.10 CONTROL ROOMS
5.10.1 2nd Floor Control Room
The control room is an area on the second floor of the Instrument
Chamber Building that houses all of the facility controls, test
equipment controls and test personnel.
This item is provided by MSFC.
5.10.2 3rd Floor Control and Experimenter's Room
This is the area on the third floor of MSFC building 4718, that
will house the team analyzing calibration data.
5.11 FACILITY
The XRCF facility provides a variety of services to the test team.
5.11.1 Vacuum System
The XRCF vacuum system consists of three main elements, the source
vacuum system (SVS), the guide tube vacuum system (GVS) and the
instrument chamber vacuum system (ICVS).
The SVS can be controlled manually or automatically, and is
continuously monitored in the X-ray Source Systemfacility control
room in building 600. Cryogenic traps will be located between the
mechanical pumps and the evacuated volumes. Roughing and pumping
system components are to be housed in environmentally controlled
buildings to protect them from the weather. All high vacuum pumps
shall be cryogenic pumps and half of the cryogenic pumps shall be
equipped with isolation valves to allow regeneration of the pumps
as required. All pumps are vibration isolated from the vacuum
vessel.
The guide tube vacuum subsystem (GVS) can be controlled manually or
automatically, and is continuously monitored in the X-ray facility
control room. Cryogenic traps will be located between the
mechanical pumps and the evacuated volumes. Roughing and pumping
system components are to be housed in environmentally controlled
buildings to protect them from the weather. All high vacuum pumps
shall be cryogenic pumps and half of the cryogenic pumps shall be
equipped with isolation valves to allow regeneration of the pumps
as required. All pumps are vibration isolated from the vacuum
vessel.
The instrument chamber vacuum subsystems (ICVS) can be controlled
manually or automatically, and is continuously monitored in the X-
ray facility control room. Cryogenic traps will be located between
the mechanical pumps and the evacuated volumes. Roughing and
pumping system components are to be house din environmentally
controlled buildings to protect them from the weather. All high
vacuum pumps shall be cryogenic pumps and half of the cryogenic
pumps shall be equipped with isolation valves to allow regeneration
of the pumps as required. All pumps are vibration isolated from
the vacuum vessel.
5.11.2 AC Power
The XRCF provides 60 Hz, 120 VAC, power on both normal circuits and
as an uninterruptable power supply (UPS). Only the UPS outlets are
assigned by this document. The location of UPS outlets are shown
in DWG E445708 and assigned in DWG E445906.
5.11.3 Thermal Control
The temperature of the evacuated volume of the IC is controlled by
a MSFC supplied thermal control system. The requirements on the
thermal control system are given in MSFC-SPEC-1838.
5.11.4 IRIG Time Code
The facility can provide an IRIG B time signal. This time code is
an MSFC utility.
5.11.5 Data Local Area Network
The facility has an local area network which is connected to the
worldwide Internet via a directional network bridge (TBR). MSFC
provides the cable that connects the ethernet controller card to
the network box.
The internet protocol (IP) addresses for all system connected to
the XRCF LAN is shown in DWG E445900.
5.11.6 SCATS
Facility data: thermal, vacuum and other status is recorded on the
MSFC system called SCATS.
5.12 MOTION DETECTION SYSTEM
The motion detection system (MDS) is used to quantify the relative
motions of the XPS, HRMA and XDA in the Y-Z plane. The MDS
consists of five subsystems, off-axis optical point source (OPS)
located on the XDASS, an imaging lens mounted offset from the X-ray
optical axis on the HRMA center baffle assembly (CBA), a position
sensing detector mounted to the fixed structure of the XPS filter
chamber and a computer system to acquire, process and record the
data.
This system, except for the MDS lens, which will be manufactured
and installed by EKC, is to be supplied by MSFC.
5.12.1 Optical Point Source
The optical point source (OPS) is an array of individually
illuminable abruptly terminated fiber optics (F/O). The injection
source terminus is located external to the IC. The operating
wavelength is the 632.8 nm helium-neon laser line.
5.12.2 Source Pedestal
MSFC will provide a mounting surface to insure the MDS point source
is located at the correct height. This structure is called the MDS
source pedestal.
5.12.3 Data
The MDS data is organized into two packets, a control packet and a
data packet. The details of the data interface and packet
structure are given in section 6.0.
5.13 OPTICAL ALIGNMENT SYSTEM
The ATA is part of the XRCF optical alignment system (OAS). The ATA
is an autocollimating telescope with a 6 inch diameter, f/8
objective operating in the green portion of the visible spectrum.
The ATA, which has been used in the past for other XRCF programs,
is used to align the HRMA to the XRCF FOA. The FOA is defined as
the line connecting the x-ray point source with the center of the
primary baffle. The ATA is used to monitor the centration and
angular alignment line-of-sight (LOS) of the HRMA throughout x-ray
testing. The ATA will also provide an FOA reference level to
gravity to within 1 arcmin. The reference will consist of either a
HeNe (red) laser beam (approximately 30 mm diameter) or the
projected reticule of the ATA. Either of these can be used as a
reference to which a collimating telescope can be aligned.
The ATA is provided by MSFC.
5.14 MASTER CONTROL COMPUTER
The AXAF master control computer is described by MSFC-SPEC-2279.
It performs the functions of automatically staging though the test
procedure and as a test data logger. There are two classes of data
interfaces, one formed between the target system and the script
processor, and the second between the target system and the data
logging and retrieval system (DLRS)
5.14.1 DLRS
The DLRS is the data recording subsystem of the MCC that will
capture all relevant test data.
5.14.2 Script Process
The script process is the process that sends and receives messages
pertaining to the execution of the test procedure. The script
process is resident on the Test Conductor's workstation, as shown
on DWG E445900.
5.15 HIGH RESOLUTION MIRROR ASSEMBLY
5.15.1 MDS Lens
The MDS lens is a plano-convex lens that is installed in the center
aperture plate (CAP). The MDS lens forms an image of the MDS
optical point source on the MDS detector.
This subsystem is provided by EKC.
5.15.2 HRMA Thermal Controller
The HRMA thermal controller includes any and all heaters,
thermocouples or thermistors, data acquisition and processing
hardware and the associated software used to control the thermal
state of the HRMA.
This subsystem is provided by EKC.
5.15.3 HRMA Support Structure
The HRMA support structure (HSS) ground support equipment (GSE)
mount that positions and orients the HRMA within the IC. The HSS
can translate the HRMA in the Y and Z directions and tip and tilt
the HRMA about the Y and Z axes to accommodate off axis testing.
This subsystem is provided by EKC.
5.15.4 HRMA
This is the flight article, per EKC specification EK-5003-100.
5.16 HRMA SHUTTER ASSEMBLY
The HRMA shutter assembly (HSA) is a quadrant shutter. The shutter
is arranged in 4 annuli corresponding to the 4 mirrors and 4
quadrants
The designation of the shutter blades is given in DWG E445909.
The HSA is built by EKC and operated by SAO as part of the HXDS
during test and calibration activities.
5.17 LETG INSERTION RETRACTION MECHANISM
The LETG insertion and retraction mechanism (LIRM) is used to move
the LETG in and out of the x-ray beam. This hardware includes the
support structure that holds the LETG in its proper location, the
motors, controllers and limit switches. The LIRM is mounted on
SETB and is provided by EKC.
5.18 HETG INSERTION RETRACTION MECHANISM
The HETG insertion and retraction mechanism (HIRM) is used to move
the HETG in and out of the x-ray beam. This hardware includes the
support structure that holds the HETG in its proper location, the
motors, controllers and limit switches. The HIRM is mounted on
SETB and is provided by EKC.
5.19 HRMA X-RAY DETECTION SYSTEM
The HRMA x-ray detection system (HXDS) is the suite of x-ray
detectors used to calibrate the HRMA and the OTGs.
5.19.1 Beam Normalization Detector-HRMA
The BND-H is used to measure the x-ray beam immediately in front of
the HRMA entrance aperture.
5.19.2 X-ray Data Acquisition and Control System
The XDACS consists of electronics and a computer control system.
The XDACS electronics will be located both in the instrument
chamber room and in the XRCF control room. The XDACS computer
control system includes computers, peripherals and interface
electronics and will be located in the control room.
The XDACS will control the HXDA and BND and acquire data from the
proportional counters (PC) and high speed imager (HSI) detectors
mounted on the HXDA and BND (TBR). It will provide an operator
interface through which the HXDA and BND are controlled, and quick
look data analysis capabilities to analyze and display the X-ray
test results.
5.19.3 Gas Supply System
The gas supply system (GSS) will provide and control gas flow to
and from all of the flowing gas proportional counters on the HXDA
and BND. The GSS includes a temperature monitor, a chamber
pressure sense line and a control system to maintain key components
at the proper operating conditions.
5.19.4 HRMA X-ray Detector Assembly
The HXDA consists of the sensors used to characterize the x-ray
image, and the necessary mechanisms for translation. The HXDA
includes both flowing and sealed gas proportional counters and the
high resolution imager.
5.20 SCIENCE INSTRUMENT MODULE FIVE AXIS MOUNT
The science instrument module five axis mount (FAM) is the fixture
that holds the integrated SIM (ISIM) in the correct position in the
x-ray beam.
The SIM FAM is to be supplied by the BASD.
In the event that the ACIS is unavailable for calibration, the ACIS
will be replaced by the ACIS 2-chip surrogate (ACIS-2C). The SIM
would be replaced by an additional translation table on the FAM,
The Late ACIS Surrogate SIM Z-Drive. The ACIS-2C and HRC would be
integrated into the LASS-Z. See 5.29 for more details.
5.20.1 FAM Controller
The FAM controller commands and controls the FAM actuators and the
SIM or LASS-Z actuators.
5.20.2 Cryo Shroud Assembly
The cryo shroud assembly (CSA) is the hardware that provides a
space-like thermal environment for the ISIM or ILASS-Z in the XRCF.
The CSA is to be supplied by the BASD.
5.21 HIGH ENERGY TRANSMISSION GRATING
The HETG is an objective transmission grating operating between
approximately 400 eV and 8 keV. The HETG consists of two gratings
the medium energy grating (MEG) and the (HEG).
5.22 LOW ENERGY TRANSMISSION GRATING
The LETG is an objective transmission grating operating between 100
eV and approximately 1.5 keV.
5.23 INTEGRATED SCIENCE INSTRUMENT MODULE
The SIM is the subsystem of AXAF-I that provides accommodation and
support services for the FPSIs. The SIM is delivered to the XRCF
for SI calibration with the government furnished equipment (GFE)
FPSIs already integrated. The integrated SIM is then integrated
into the FAM for the SI calibration activity. The SIM motors are
not exercised during SI calibration.
The ISIM is to be supplied by the BASD.
In the event that the ACIS is unavailable for calibration, the ACIS
will be replaced by the ACIS 2-chip surrogate (ACIS-2C). The SIM
would be replaced by an additional translation table on the FAM,
The Late ACIS Surrogate SIM Z-Drive. The ACIS-2C and HRC would be
integrated into the LASS-Z. See 5.29 for more details.
5.24 AXAF CCD IMAGING SPECTROMETER
The ACIS is one of the two FPSIs to be calibrated during the XRCF
activity for AXAF-I. For the purposes of this document the ACIS is
considered to have two subsystems, the instrument and the EGSE.
In the event that the ACIS is unavailable for calibration, the ACIS
will be replaced by the ACIS 2-chip surrogate (ACIS-2C). The SIM
would be replaced by an additional translation table on the FAM,
The Late ACIS Surrogate SIM Z-Drive. The ACIS-2C and HRC would be
integrated into the LASS-Z. See 5.29 for more details.
5.24.1 ACIS Instrument
For the purposes of this document the ACIS instrument is defined as
the hardware integrated by BASD into the delivered SIM.
5.24.2 ACIS EGSE
For the purposes of this document the ACIS EGSE is defined as all
the hardware necessary for the operation of the ACIS during
calibration activity, that is not integrated into the SIM.
5.25 HIGH RESOLUTION CAMERA
The HRC is one of the two FPSIs to be calibrated during the XRCF
activity for AXAF-I. For the purposes of this document the HRC is
considered to have two subsystems, the instrument and the
controller.
5.25.1 HRC Instrument
For the purposes of this document the HRC instrument is defined as
the hardware integrated by BASD into the SIM.
5.25.2 HRC EGSE
For the purposes of this document the HRC EGSE is defined as all
the hardware necessary for the operation of the HRC during
calibration activity, that is not integrated into the SIM.
5.26 COMMAND TELEMETRY UNIT EMULATOR
The command telemetry unit emulator (CTUE) provides a common
interface between the EGSE and the FPSIs through the AXAF
integration process. The CTUE is defined in detail in EQ16-0057.
5.27 DEEP SPACE SIMULATOR
The deep space simulator (DSS) is used to simulate the thermal
environment of deep space on the entrance aperture of the HRMA
during HRMA thermal balance test. The DSS is shown on DWG E445911
and is provided by MSFC.
5.28 X-RAY SURROGATE OPTIC
The x-ray surrogate optic (XSO) is used during the pre-calibration
rehearsal. Its purpose is to provide a HRMA like x-ray image to
allow for hardware demonstration and operator training in a
calibration like environment.
5.28.1 XSO
The requirements on the XSO are given in sections 3.4.18.1 of XC02.
The XSO is supplied by MSFC.
5.28.2 XSO MOUNT
The XSO mount holds the XSO at the proper height in the x-ray beam
relative to the FOA.
This system is to be provided by SAO.
5.29 Late ACIS Contingency Systems
In the event that the ACIS is unavailable for calibration, the ACIS
will be replaced by the ACIS 2-chip surrogate (ACIS-2C). The SIM
would be replaced by an additional translation table on the FAM,
The Late ACIS Surrogate SIM Z-Drive. The ACIS-2C and HRC would be
integrated into the LASS-Z.
5.29.1 ACIS Surrogate
For the purposes of this document, the ACIS-2C instrument is
defined as the breadboard copy of the ACIS, shown in DWG E445937.
5.29.2 ACIS-2C EGSE
For the purposes of this document the ACIS-2C EGSE is defined as
all the hardware necessary for the operation of the ACIS-2C during
calibration activity that is not integrated into the LASS-Z.
5.29.3 Late ACIS Surrogate Z-Drive
The LASS-Z is an additional component of the FAM, used to replace
the SIM in the event that the ACIS is unavailable for calibration
and the ACIS-2C is used. The LASS-Z will translate the ACIS-2C and
the HRC in the XRCF-Z direction to place the desired FPSI in the
beam path.
Supplied by BASD.
5.29.4 LASS-Z Controller
The LASS-Z acutators are controlled by the FAM controller, which
commands and controls the FAM actuators and the SIM or LASS-Z
actuators.
Supplied by BASD.
6.0 INTERFACE DEFINITIONS
This section contains the definitions of the interfaces formed
among the equipment provided by the various team members.
The term interface is used to define the interrelationship of any
GFE, contractor GSE, STE, XRCF and HRMA hardware used in the course
of HRMA/SI calibration.
Mechanical interfaces are defined to involve the alignment,
positioning, area and volume allocation, structural integrity and
mounting schemes.
Optical interfaces are defined to involve the transit of optical
energy through a window, space or incident on a detector.
Electrical interfaces are divided into two sub-categories, the
first involving electrical power and the second dealing with
data/control lines.
Power interfaces are defined to involve any necessary electrical
power required by the HRMA, GSE, STE and supplied by the XRCF.
Data/Control interfaces are defined as involving the transmission
of data or commands to and from various computers for the purposes
of hardware control and data recording.
Contamination interfaces are defined as being involved with making
hardware that is to be installed in clean and vacuum areas
compatible with such areas. This is necessary so as not to
contaminate the instrument chamber, HRMA mirrors or other clean or
vacuum area.
Fluid interfaces are defined to involve the transportation and
proper venting or draining of effluent fluids. For the purposes of
this document, a fluid is defined to be either a liquid or a gas.
An environmental interface is defined to exist when hardware either
induces or requires a specific environment that deviates from the
ambient temperature, atmospheric pressure or humidity or standard
test environment.
6.1 N-SQUARED DIAGRAM
The N2 diagram shown in DWG E445782 is a graphical depiction of
the possible HRMA interfaces. In this diagram, the equipment is
listed along the main diagonal of the matrix and the intersections
marked with a circle, triangle or square denote the existence of an
interface. In the case of the HRMA test interfaces, all of the
interfaces are symmetric. Therefore, the interface may correctly
described regardless of which item is considered to be mated to
which. Since the lower half would be a mirror reflection of the
top half, only the upper half of the matrix is presented.
The N2 diagram is also grouped into subsystem supplied by different
team members denoted as the dashed perimeter large boxes located
along the main diagonal. Interfaces identified with squares are
intra-team member and are not defined but are identified in this
document. Also identified by dashed boxes are major subsystems.
These subsystems may also be readily identified by paragraph
number, which is given for all entries in the diagram.
6.2 INTERFACE DEFINITIONS
This section contains the interface definitions appropriate to the
AXAF-I x-ray test and SI calibration activity.
6.2.1 XSS-BND-H
This interface defines the allowed locations of the BND-H in the x-
ray beam. Interface identified on the N2 diagram, DWG E445782, as
I/F 1,61, 2,61, 3,61, and 4,61.
6.2.1.1 Mechanical
The allowed locations of the BND detectors are outside the HRMA
clear aperture and inside the x-ray beam. The allowed locus is
also illustrated superimposed on the BND shown in DWG E445700,
sheet 7.
6.2.2 XSS-BND-500
This interface defines the allowed locations of the BND-500 in the
x-ray beam. Interface identified on the N2 diagram, DWG E445782, as
I/F 1,62, 2,62, 3,62, and 4,62.
6.2.2.1 Mechanical
The allowed locations of the BND detectors are outside the HRMA
clear aperture and inside the x-ray beam. The allowed locus is
also illustrated superimposed on the BND-500 baffle as shown in DWG
E445901, sheet 1.
6.2.3 GTA-BND-500
The interface between the guide tube assembly and the BND-500 is
defined in the sections below. Interface identified on the N2
diagram, DWG E445782, as I/F 7,62.
6.2.3.1 Mechanical
6.2.3.1.1 Floor Space
These interfaces are given on DWG E445927.
6.2.3.1.2 Guide Tube Mounting
These interfaces for mounting of the BND-500 hardware within the
GTA are given on DWG E445901, sheets 2,3 and 4.
6.2.3.2 Electrical
The electrical feedthroughs are defined on DWG E445901, sheet 2.
6.2.3.3 Fluid
The fluid feedthroughs are defined on DWG E445901, sheet 2.
6.2.4 IC-HRMA
This section defines the interface between the HRMA and the IC.
This interface has mechanical, electrical, fluid and contamination
elements. Interface identified on the N2 diagram, DWG E445782, as
I/F 9,43.
6.2.4.1 Mechanical
The space allocation for the HRMA is given by DWG E445700, sheet 2.
6.2.4.2 Contamination
Bagging, staging and handling shall be compatible with DR SE28.
6.2.4.3 HRMA Fluid
To provide fluid interface between the IC and the HRMA the
following fluid feedthroughs have been assigned. EKC is required
to supply all the necessary hosing to connect the interface to the
hardware located internal and external to the IC. Access to the
assigned feedthroughs is made on the north west side of the IC on
the 1st floor ICR. The number and description of the fluid
interface is given in DWG E445923.
6.2.5 IC-Contamination Covers
Interface identified on the N2 diagram, DWG E445782, as I/F 9,47.
6.2.5.1 Space Envelope
The contamination cover shall not penetrate the space envelope as
defined in DWG E445700, view K.
6.2.6 IC-HSS
This section defines the interface between the HRMA and the IC.
This interface has mechanical, electrical, and contamination
elements. Interface identified on the N2 diagram, DWG E445782, as
I/F 9,50.
6.2.6.1 Mechanical
The space allocation for the HRMA is given by DWG E445700.
6.2.6.2 Contamination
Bagging, staging and handling shall be compatible with DR SE28.
6.2.6.3 Electrical
The electrical connectors assigned for use by the HRMA are 301-307,
311-322 and 328-331.
For details of the interface see Appendix A, Wiring Interface
Detailed Database.
6.2.7 IC-HRMA SHUTTER ASSEMBLY
This section defines the IC/HSA interface. There are mechanical and
contamination elements in this interface. Interface identified on
the N2 diagram, DWG E445782, as I/F 9,52.
6.2.7.1 Mechanical
The space allocation for the HSA in the IC is given in DWG E445700.
6.2.7.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.8 IC-LIRM
This section defines the IC/LIRM interface. There are mechanical
and contamination elements in this interface. Interface identified
on the N2 diagram, DWG E445782, as I/F 9,53
6.2.8.1 Mechanical
The space allocation for the LIRM in the IC is given in DWG
E445700.
6.2.8.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.9 IC-HIRM
This section defines the IC/HIRM interface. There are mechanical
and contamination elements in this interface. Interface identified
on the N2 diagram, DWG E445782, as I/F 9,54.
6.2.9.1 Mechanical
The space allocation for the LIRM in the IC is given in DWG
E445700.
6.2.9.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.10 IC-GSS
This section defines the fluid interface between the SAO supplied
GSS and the IC. This interface has elements for the HXDA and the
BND. Interface identified on the N2 diagram, DWG E445782, as I/F
9,59.
6.2.10.1 HXDA Fluid
To provide fluid interface between the IC and the HXDA the
following fluid feedthroughs have been assigned. SAO is required
to supply all the necessary hosing to connect the interface to the
hardware located internal and external to the IC. Access to the
assigned feedthroughs is made on the north east side of the IC on
the 1st floor ICR. The number and description of the fluid
interface is given in DWG E445923.
6.2.10.2 BND-H Fluid
To provide fluid interface between the IC and the BND-H the
following fluid feedthroughs have been assigned. SAO is required
to supply all the necessary hosing to connect the interface to the
hardware located internal and external to the IC. Access to the
assigned feedthroughs is made on the north west side of the IC on
the 1st floor ICR. The number and description of the fluid
interface is given in DWG E445923.
6.2.11 IC-HXDA
This section defines the IC/HXDA interface. There are mechanical
and contamination elements in this interface. Interface identified
on the N2 diagram, DWG E445782, as I/F 9,60. Also paragraph
6.2.133.
6.2.11.1 Mechanical
The space allocation for the HXDA in the IC is given in DWG
E445700.
6.2.11.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.12 IC-BND-H
This section defines the IC/HXDA interface. There are mechanical
and contamination elements in this interface. Interface identified
on the N2 diagram, DWG E445782, as I/F 9,61. Also, paragraph
6.2.135
6.2.12.1 Mechanical
The space allocation for the HXDA in the IC is given in DWG
E445700.
6.2.12.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.13 IC-FAM
This section defines the IC/HXDA interface. There are mechanical
and contamination elements in this interface. Interface identified
on the N2 diagram, DWG E445782, as I/F 9,63. Also paragraph
6.2.139.
6.2.13.1 Mechanical
The space allocation for the HXDA in the IC is given in DWG
E445700.
6.2.13.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.14 IC-CSA
This section defines the IC/HXDA interface. There are mechanical
and contamination elements in this interface. Interface identified
on the N2 diagram, DWG E445782, as I/F 9,65.
6.2.14.1 Mechanical
The space allocation for the HXDA in the IC is given in DWG
E445700.
6.2.14.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.14.3 Fluid
The fluid interfaces for the LN2 needed by the CSA are defined on
DWG E445923.
6.2.15 IC-FAM Control
Interface identified on the N2 diagram, DWG E445782, as I/F 9,6.
6.2.15.1 Electrical
The space allocation for the HXDA in the IC is given in DWG
E445700.
6.2.15.2 Contamination
The handling and bagging procedures shall be compatible with DR
SE28.
6.2.16 IC-CTUE
Interface identified on the N2 diagram, DWG E445782, as I/F 9,78.
6.2.16.1 Electrical
The connectors assigned to the interface of the CTUE control,
signal and power wires are 175-176, and 415-416.
The details of the interface are found in Appendix A.
6.2.17 SETB-HRMA SS
Interface identified on the N2 diagram, DWG E445782, as I/F 11,50.
6.2.17.1 Mechanical
This interface is defined in DWG E445700, sheet 5.
6.2.18 DETB-FAM
Interface identified on the N2 diagram, DWG E445782, as I/F 12,63.
6.2.18.1 Mechanical
This interface is defined in DWG E445700, sheet 9.
6.2.19 XDASS-HXDA
Interface identified on the N2 diagram, DWG E445782, as I/F 57,60.
6.2.19.1 Mechanical
This interface is defined in DWG E445700, sheet 4.
6.2.20 SEAP-HRMA
Interface identified on the N2 diagram, DWG E445782, as I/F 14,43.
6.2.20.1 Access
The personnel access interface is formed by the chamber walkways.
DWG E445706 illustrate the various access interfaces to the HRMA
after installation in the HSS on the SETB.
6.2.21 SEAP-HRMA SS
This section defines the interface between the AP and the HSS. This
interface is formed to allow for personnel access to the HSS while
it is installed upon SETB and is either in or out of the IC.
Interface identified on the N2 diagram, DWG E445782, as I/F 14,50.
6.2.21.1 Access
The personnel access interface is formed by the chamber walkways
and the CRWP. DWG's E445706 and E445706 illustrate the various
access interfaces to the HSS after installation on the SETB.
6.2.22 SEAP-HRMA Purge Unit
This section defines the interface between the AP and the HRMA
Purge Unit. This interface is formed to allow for personnel access
to the Purge Unit while it is installed upon SETB and is either in
or out of the IC. Interface identified on the N2 diagram, DWG
E445782, as I/F 14,51.
6.2.22.1 Access
The personnel access interface is formed by the chamber walkways
and the CRWP. DWGs E445706 and E445706 illustrate the various
access interfaces to the Purge Unit after installation on the SETB.
6.2.23 SEAP-HRMA SHUTTER ASSEMBLY
This section defines the interface between the AP and the HSA. This
interface is formed to allow for personnel access to the HSA while
it is installed upon SETB and is either in or out of the IC.
Interface identified on the N2 diagram, DWG E445782, as I/F 14,52.
6.2.23.1 Access
The personnel access interface is formed by the chamber walkways
and the CRWP. DWGs E445706 and E445706 illustrate the various
access interfaces to the HSA after installation on the SETB.
6.2.24 SEAP-LIRM
This section defines the interface between the AP and the LIRM.
This interface is formed to allow for personnel access to the LIRM
while it is installed upon SETB and is either in or out of the IC.
Interface identified on the N2 diagram, DWG E445782, as I/F 14,53.
6.2.24.1 Access
The personnel access interface is formed by the chamber walkways,
the CRWP, and the BTWGS. DWGs E445705, E445706, E445914, and
E445918 illustrate the various access interfaces to the LIRM after
installation on the SETB.
6.2.25 SEAP-HIRM
This section defines the interface between the AP and the HIRM.
This interface is formed to allow for personnel access to the HIRM
while it is installed upon SETB and is either in or out of the IC.
Interface identified on the N2 diagram, DWG E445782, as I/F 14,54.
6.2.25.1 Access
The personnel access interface is formed by the chamber walkways,
the CRWP, and the BTWGS. DWGs E445705, E445706, E445914, and
E445918 illustrate the various access interfaces to the HIRM after
installation on the SETB.
6.2.26 SEAP-LETG
This section defines the interface between the AP and the LETG.
This interface is formed to allow for personnel access to the LETG
while it is installed upon LIRM and is either in or out of the IC.
Interface identified on the N2 diagram, DWG E445782, as I/F 14,55.
6.2.26.1 Access
The personnel access interface is formed by the chamber walkways,
internal AP, external AP, and the BTWGS. DWGs E445705, E445706,
E445914, and E445918 illustrate the various access interfaces to
the LETG.
6.2.27 SEAP-HETG
This section defines the interface between the AP and the HETG.
This interface is formed to allow for personnel access to the HETG
while it is installed in the HIRM and is either in or out of the
IC. Interface identified on the N2 diagram, DWG E445782, as I/F
14,56.
6.2.27.1 Access
The personnel access interface is formed by the chamber walkways,
internal AP, external AP, and the BTWGS. DWGs E445705, E445706,
E445914, and E445918 illustrate the various access interfaces to
the HETG.
6.2.28 DEAP-HXDA
This section defines the interface between the AP and the HXDA.
This interface is formed to allow for personnel access to the HXDA
while it is installed upon DETB and is either in or out of the IC.
Interface identified on the N2 diagram, DWG E445782, as I/F 15,60.
6.2.28.1 Access
The personnel access interface is formed by the chamber walkways,
internal AP, external AP, and CRWP. DWGs E445705 and E445706
illustrate the various access interfaces to the HXDA after
installation on the XDASS.
6.2.29 DEAP-FAM
This section defines the interface between the AP and the FAM. This
interface is formed to allow for personnel access to the FAM while
it is installed upon DETB and is in the IC. Interface identified on
the N2 diagram, DWG E445782, as I/F 15,63.
6.2.29.1 Access
The personnel access interface is formed by the chamber walkways.
DWGs E445705, E445706 and E445912 illustrate the various access
interfaces to the FAM after installation on the DETB.
6.2.30 DEAP-CSA
This section defines the interface between the AP and the CSA. This
interface is formed to allow for personnel access to the CSA while
it is installed upon DETB and is in the IC. Interface identified on
the N2 diagram, DWG E445782, as I/F 15,65.
6.2.30.1 Access
The personnel access interface is formed by the chamber walkways.
DWGs E445705, E445706 and E445912 illustrate the various access
interfaces to the CSA after installation on the DETB.
6.2.31 CRWP-HRMA
Interface identified on the N2 diagram, DWG E445782, as I/F 17,43.
6.2.31.1 Access
The personnel access interface is formed by the external AP. DWG
E445705 illustrates the various access interfaces to the HRMA.
6.2.32 CRWP-HRMA SS
This section defines the interface between the CRWP and the HSS.
This interface is formed to allow for personnel access to the HSS
while it is installed upon SETB and is out of the IC. Interface
identified on the N2 diagram, DWG E445782, as I/F 17,50.
6.2.32.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the HRMA SS.
6.2.33 CRWP-HRMA SHUTTER ASSEMBLY
This section defines the interface between the CRWP and the HSA.
This interface is formed to allow for personnel access to the HSA.
Interface identified on the N2 diagram, DWG E445782, as I/F 17,52.
6.2.33.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the HSA after
installation on the SETB.
6.2.34 CRWP-LIRM
This section defines the interface between the CRWP and the LIRM.
This interface is formed to allow for personnel access to the LIRM
while it is installed upon SETB. Interface identified on the N2
diagram, DWG E445782, as I/F 17,53.
6.2.34.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the LIRM after
installation on the SETB.
6.2.35 CRWP-HIRM
This section defines the interface between the CRWP and the HIRM.
This interface is formed to allow for personnel access to the HIRM
while it is installed upon SETB. Interface identified on the N2
diagram, DWG E445782, as I/F 17,54.
6.2.35.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the HIRM after
installation on the SETB.
6.2.36 CRWP-LETG
This section defines the interface between the CRWP and the LETG.
This interface is formed to allow for personnel access to the LETG
while it is installed and is out of the IC. Interface identified on
the N2 diagram, DWG E445782, as I/F 17,55.
6.2.36.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the LETG after
installation.
6.2.37 CRWP-HETG
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the HETG after
installation on the SETB. Interface identified on the N2 diagram,
DWG E445782, as I/F 17,56.
6.2.37.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the HETG after
installation.
6.2.38 CRWP-HXDA
This section defines the interface between the CRWP and the HXDA.
This interface is formed to allow for personnel access to the HXDA.
Interface identified on the N2 diagram, DWG E445782, as I/F 17,60.
6.2.38.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the HXDA after
installation on the XDASS.
6.2.39 CRWP-FAM
This section defines the interface between the CRWP and the FAM.
This interface is formed to allow for personnel access to the FAM.
Interface identified on the N2 diagram, DWG E445782, as I/F 17,63.
6.2.39.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the FAM after
installation on the DETB.
6.2.40 CRWP-CSA
This section defines the interface between the CRWP and the CSA.
This interface is formed to allow for personnel access to the CSA.
Interface identified on the N2 diagram, DWG E445782, as I/F 17,65.
6.2.40.1 Access
The personnel access interface is formed by the CRWP. DWG E445705
illustrates the various access interfaces to the CSA after
installation on the DETB.
6.2.41 CRC-HRMA
The section defines the operating parameters and hook inter-face
between the HRMA and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,43.
6.2.41.1 Crane Operating Parameters
See Table 5.6.
6.2.41.2 Hook Definition
See DWG E445705 sheet 3.
6.2.42 CRC-HRMA SS
The section defines the operating parameters and hook inter-face
between the HSS and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,50.
6.2.42.1 Crane Operating Parameters
See Table 5.6.
6.2.42.2 Hook Definition
See DWG E445705, sheet 3.
6.2.43 CRC-Shutter Assembly
The section defines the operating parameters and hook inter-face
between the HSA and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,52.
6.2.43.1 Crane Operating Parameters
See Table 5.6.
6.2.43.2 Hook Definition
See DWG E445705, sheet 3.
6.2.44 CRC-LETG
The section defines the operating parameters and hook inter-face
between the LETG and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,55.
6.2.44.1 Crane Operating Parameters
See Table 5.6.
6.2.44.2 Hook Definition
See DWG E445705, sheet 3.
6.2.45 CRC-HETG
The section defines the operating parameters and hook inter-face
between the HETG and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,56.
6.2.45.1 Crane Operating Parameters
See Table 5.6.
6.2.45.2 Hook Definition
See DWG E445705, sheet 3.
6.2.46 CRC-HXDA
The section defines the operating parameters and hook inter-face
between the HXDA and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,60.
6.2.46.1 Crane Operating Parameters
See Table 5.6.
6.2.46.2 Hook Definition
See DWG E445705, sheet 3.
6.2.47 CRC-BND-H
The section defines the operating parameters and hook inter-face
between the BND-H and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,61. Also paragraph 6.2.137.
6.2.47.1 Crane Operating Parameters
See Table 5.6.
6.2.47.2 Hook Definition
See DWG E445705, sheet 3.
6.2.48 CRC-FAM
The section defines the operating parameters and hook inter-face
between the FAM and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,63.
6.2.48.1 Crane Operating Parameters
See Table 5.6.
6.2.48.2 Hook Definition
See DWG E445705, sheet 3.
6.2.49 CRC-CSA
The section defines the operating parameters and hook inter-face
between the CSA and the clean room crane. Interface identified on
the N2 diagram, DWG E445782, as I/F 19,65.
6.2.49.1 Crane Operating Parameters
See Table 5.6.
6.2.49.2 Hook Definition
See DWG E445705, sheet 3.
6.2.50 CR-HRMA
This section defines the interface between the HRMA and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,43.
6.2.50.1 Mechanical
6.2.50.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.50.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.50.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.51 CR-HRMA SS
This section defines the interface between the HRMA support
structure and the clean room. Interface identified on the N2
diagram, DWG E445782, as I/F 20,50.
6.2.51.1 Mechanical
6.2.51.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.51.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.51.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.52 CR-HRMA Purge Unit
This section defines the routing of the HRMA purge lines from the
1st floor ICR through the HRMA purge interface and into the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,51.
6.2.53 CR-LIRM
This section defines the interface between the LIRM and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,53.
6.2.53.1 Mechanical
6.2.53.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.53.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.53.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.54 CR-HIRM
This section defines the interface between the HIRM and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,54.
6.2.54.1 Mechanical
6.2.54.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.54.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.54.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.55 CR-LETG
This section defines the interface between the LETG and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,55.
6.2.55.1 Mechanical
6.2.55.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.55.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.55.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.56 CR-HETG
This section defines the interface between the HETG and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,56.
6.2.56.1 Mechanical
6.2.56.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.56.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.56.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.57 CR-HXDA
This section defines the interface between the HXDA and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,60.
6.2.57.1 Mechanical
6.2.57.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.57.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.57.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.57.3 Clean Room Bulkhead
The interface for the user-supplied clean room bulkhead is given in
DWG E445925.
6.2.58 CR-BND-H
This section defines the interface between the BND-H and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,61.
6.2.58.1 Mechanical
6.2.58.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.58.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.58.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.58.3 Clean Room Bulkhead
The interface for the user-supplied clean room bulkhead is given in
DWG E445925.
6.2.59 CR-FAM
This section defines the interface between the FAM and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,63.
6.2.59.1 Mechanical
6.2.59.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.59.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.59.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.59.3 Clean Room Bulkhead
The interface for the user-supplied clean room bulkhead is given in
DWG E445925.
6.2.60 CR-CSA
This section defines the interface between the CSA and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,65.
6.2.60.1 Mechanical
6.2.60.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.60.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.60.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.60.3 Clean Room Bulkhead
The interface for the user-supplied clean room bulkhead is given in
DWG E445925.
6.2.61 CR-SIM
This section defines the interface between the SIM and the clean
room. Interface identified on the N2 diagram, DWG E445782, as I/F
20,67.
6.2.61.1 Mechanical
6.2.61.1.1 Clean Room Floor
The floor loading is defined on DWG E445709.
6.2.61.1.2 Clearance
See DWG E445709 for clearance during hardware staging.
6.2.61.2 Contamination
The contamination interface is defined by control procedures given
in DR SE28.
6.2.61.3 Clean Room Bulkhead
The interface for the user-supplied clean room bulkhead is given in
DWG E445925.
6.2.62 IUD-HRMA
Interface identified on the N2 diagram, DWG E445782, as I/F 21,43.
6.2.62.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.63 IUD-HRMA SS
Interface identified on the N2 diagram, DWG E445782, as I/F 21,50.
6.2.63.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.64 IUD-LETG
Interface identified on the N2 diagram, DWG E445782, as I/F 21,55.
6.2.64.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.65 IUD-HETG
Interface identified on the N2 diagram, DWG E445782, as I/F 21,56.
6.2.65.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.66 IUD-HXDA
Interface identified on the N2 diagram, DWG E445782, as I/F 21,60.
6.2.66.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.67 IUD-BND-H
Interface identified on the N2 diagram, DWG E445782, as I/F 21,61.
6.2.67.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.68 IUD-FAM
Interface identified on the N2 diagram, DWG E445782, as I/F 21,63.
6.2.68.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.69 IUD-CSA
Interface identified on the N2 diagram, DWG E445782, as I/F 21,65.
6.2.69.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.70 IUD-SIM
Interface identified on the N2 diagram, DWG E445782, as I/F 21,67.
6.2.70.1 Mechanical
The clearance and loading dock size is given in DWG E445709. All
shipping containers will be compatible with the size of the
hydraulically actuated platform.
6.2.71 1st FLOOR ICR-HRMA PURGE UNIT
Interface identified on the N2 diagram, DWG E445782, as I/F 22,51.
6.2.71.1 Mechanical
The floor space allocation for the GSS is given in DWG E445923.
6.2.71.2 Electrical Power
The electrical power outlet for the HRMA purge unit is designated
as the upper outlet RAA-14, as shown in DWG E445708 on the north
side of the ICR first floor.
6.2.72 1st FLOOR ICR-GSS
Interface identified on the N2 diagram, DWG E445782, as I/F 22,59.
6.2.72.1 Mechanical
The floor space allocation for the GSS is given in DWG E445923.
6.2.72.2 Electrical Power
The electrical power outlet for the GSS is designated as the lower
outlet RAA-14, as shown in DWG E445708 on the north side of the ICR
first floor.
6.2.73 2nd FLOOR ICR-HRMA CONTROLLER
Interface identified on the N2 diagram, DWG E445782, as I/F 23,49.
6.2.73.1 Floor Space
The floor space allocation for the HRMA controller racks located in
the 2nd floor ICR is shown in DWG E445709, sheet 3 and 5.
6.2.74 2nd FLOOR ICR-XDACS
This interface defines the location of the SAO supplied XDACS
hardware resident in the XRCF control room. Interface identified on
the N2 diagram, DWG E445782, as I/F 23,57.
6.2.74.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.75 2nd FLOOR ICR-FAM CONTROL
This interface defines the location of the BASD supplied FAM
hardware resident in the XRCF control room. Interface identified on
the N2 diagram, DWG E445782, as I/F 23,66.
6.2.75.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.76 ICR CRANE-HRMA CONTROLLER
This section defines the interface to the ICR crane necessary to
lift hardware from the first floor ICR to the second floor ICR.
Interface identified on the N2 diagram, DWG E445782, as I/F 24,49.
6.2.76.1 Crane Operating Parameters
Crane operating parameters are given in Table 5.9.3.
6.2.76.2 Dumbwaiter
The dumbwaiter is defined in DWG E445709.
6.2.77 2nd FLOOR CONTROL ROOM-EKC HACS
This interface defines the location of the EKC supplied HRMA
controller hardware resident in the XRCF control room. Interface
identified on the N2 diagram, DWG E445782, as I/F 25,49.
6.2.77.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.77.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.78 2nd FLOOR CONTROL ROOM-BND-H
Interface identified on the N2 diagram, DWG E445782, as I/F 25,61.
6.2.78.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.78.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.79 2nd FLOOR CONTROL ROOM-FAM EGSE
Interface identified on the N2 diagram, DWG E445782, as I/F 25,66.
6.2.79.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.79.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.80 2nd FLOOR CONTROL ROOM-CSA
Interface identified on the N2 diagram, DWG E445782, as I/F 25,65.
6.2.80.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.80.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.81 2nd FLOOR CONTROL ROOM-SIM
Interface identified on the N2 diagram, DWG E445782, as I/F 25,67.
6.2.81.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.81.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.82 2nd FLOOR CONTROL ROOM-ACIS EGSE
Interface identified on the N2 diagram, DWG E445782, as I/F 25,69.
6.2.82.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.82.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.83 2nd FLOOR CONTROL ROOM-HRC EGSE
Interface identified on the N2 diagram, DWG E445782, as I/F 25,75.
6.2.83.1 Mechanical
The floor space allocation for this hardware is defined in DWG
E445709.
6.2.83.2 Electrical Power
The electrical (120 VAC) power is assigned on DWG E445708.
6.2.84 3rd FLOOR ROOM-LETG
Interface identified on the N2 diagram, DWG E445782, as I/F 26,55.
6.2.84.1 Mechanical
The floor space allocation for this hardware is TBD on DWG E445709.
6.2.84.2 Electrical Power
The electrical (120 VAC) power is given in DWG E445708.
6.2.85 3rd FLOOR ROOM-HETG
Interface identified on the N2 diagram, DWG E445782, as I/F 26,56.
6.2.85.1 Mechanical
The floor space allocation for this hardware is TBD on DWG E445709.
6.2.85.2 Electrical Power
The electrical (120 VAC) power is TBD on DWG E445708.
6.2.86 VACUUM SYSTEM-HRMA
This paragraph defines the interface between maximum instantaneous
rate of pressurization/depressurization between the vacuum
subsystem for the IC and the HRMA. Interface identified on the N2
diagram, DWG E445782, as I/F 27,43.
6.2.86.1 Environmental
The rate of instantaneous pressurization/depressurization in the IC
shall not exceed 1 torr per minute.
6.2.87 VACUUM SYSTEM-HRMA PURGE UNIT
This section defining the interface between the XRCF vacuum
controller and the HRMA purge unit is necessary to implement a high
voltage (HV) shut off, to avoid any damage to test hardware due to
arcing. This interface has a single electrical element. Interface
identified on the N2 diagram, DWG E445782, as I/F 27,51.
6.2.87.1 High Voltage Enable
The XRCF controller will provide an HV control signal scheme. If
the controlstatus signal is 28 volts, the system is operational.
The logic table for the HV control is given below.
Table 6.2.87.1 - High Voltage Enable Logic Table
Control Line (L) Mode (M)
High (28V)Low ( OV) Safe, system working.(Vac < 5x10-6)
Low ( 0V)High (28V) Unsafe, system down (Vac > 5x10-6)
MSFC will provide cable with RG58 connectors for control line
signals. Locations of the cables are shown on drawing E445708 of
Book II.TBD.
In consideration of the HRC microchannel plates, the control line
sha